Tacky Paste Fluxes |
Class |
WS-4200-TF
Data
Sheet (PDF)
MSDS
(PDF) |
The WS-4200-TF is
a low viscosity water soluble flux. Ideal for BGA, PGA and CSP
sphere or pin attachment. Can be Dot dispensed or Screen
printed. |
REMO |
WS-4100-TF
Data
Sheet (PDF)
MSDS
(PDF) |
WS-4100-TF is a
low viscosity, low voiding flux that can be exposed to
multiple reflow processes prior to washing. The WS-4100-TF is
ideal for sphere or pin attachment to BGA or PGA
packages. |
REMO |
SynTECH-TF
Data
Sheet (PDF)
MSDS
(PDF) |
The SynTECH-TF is
a low viscosity no-clean flux that can be used for rework,
sphere attachment to BGA packages and assembly operations such
as Flip Chip attachment to PWB substrates. The SynTECH-TF
doesn't require refrigeration for six months. |
RELO |
NC-559-TF
Data
Sheet (PDF)
MSDS
(PDF) |
The NC-559-TF is
a high viscosity no-clean flux that can be used for rework,
sphere or pin attachment to BGA, CGA and CSP packages, and
assembly operations such as Flip Chip attachment to PWB
substrates. |
RELO |
RMA-223-TF
Data
Sheet (PDF)
MSDS
(PDF) |
The RMA-223-TF is
an RMA flux that can be used for rework, sphere attachment to
BGA, CGA and CSP packages. It can be Dot dispensed, Screen
printed and Stencil printed. |
REMO |
WS-4200-LFTF
Data
Sheet (PDF)
MSDS
(PDF) |
The NWS-4200-LFTF
is a water washable tacky flux formulated and designed to meet
the reflow temperatures for lead-free alloys. This Pb-free
tacky flux can maintain excellent cleanability even at
elevated reflow temperatures. It can be used for rework,
sphere attachment to BGA packages and assembly operations such
as Flip Chip attachment. |
REMO |
SynTECH-LFTF
Data
Sheet (PDF)
MSDS
(PDF) |
The SynTECH-LFTF
is a no-clean tacky flux designed to meet the reflow
temperatures for Pb-free alloys, while maintaining a clear
flux residue. Used for rework, BGA, CGA, and CSP
packages. |
RELO |
RMA-223-LFTF
Data
Sheet (PDF)
MSDS
(PDF) |
The RMA-223-LFTF
tacky flux is designed to meet the requirements of Pb-free
alloys. It delivers excellent wetting and spread on many
lead-free board finishes. . Used for rework, BGA, CGA, and CSP
packages. |
REMO |
|
Packaging: 10cc
and 30cc Syringes and 75 and 150g jars. |
|